Yamaha Motor, a leading manufacturer in the field of semiconductor production equipment, is set to launch its groundbreaking new product, the “YRP10” cream solder printing machine, on August 1st.
This state-of-the-art machine achieves a remarkable combination of high speed and precision, revolutionizing the solder printing process. With a core cycle time of just 6 seconds, it delivers exceptional printing performance while maintaining a high level of accuracy, with a tolerance of ±16μm and a Cpk value exceeding 2.0.
The YRP10 features an innovative 3S head that allows for flexible adjustment and modification of the squeegee’s attack angle and speed. This enables printing under optimal conditions tailored to the specific solder being used. Moreover, the machine incorporates a redesigned squeegee and optimized materials and shapes, resulting in enhanced mask longevity, improved rolling and filling capabilities, and reduced solder adhesion issues. These advancements lead to superior print quality and minimize solder waste.
To ensure precise and stable printing, the YRP10 minimizes the impact of mask frame distortion and stencil elongation by employing a suction fixation system that securely holds the stencil portion of the mask. This promotes closer contact between the substrate and mask, enabling highly accurate and consistent printing results. Additionally, the machine eliminates the need for offset input during reciprocating printing, significantly reducing setup time.
The YRP10 also offers advanced automation features, including automatic push-up pin and mask replacement, as well as automated solder transfer and supply. These options enable streamlined setup changes and facilitate extended non-stop operation. Furthermore, the machine can be configured with a dual-lane setup, allowing for independent operation on each lane, offering unparalleled flexibility to adapt to diverse production scenarios.
Yamaha Motor’s YRP10 represents a groundbreaking advancement in the realm of solder printing and setup optimization. With its exceptional performance and cutting-edge features, it is set to transform the semiconductor manufacturing landscape.